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"Advances in the drop-impact reliability of solder joints for mobile ..."
Ee-Hua Wong et al. (2009)
- Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai:
Advances in the drop-impact reliability of solder joints for mobile applications. Microelectron. Reliab. 49(2): 139-149 (2009)
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