"Cu-SiO2 hybrid bonding simulation including surface roughness and ..."

Thomas Wlanis et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.05.005

access: closed

type: Journal Article

metadata version: 2020-10-26

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Thomas Wlanis, René Hammer, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier:
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. Microelectron. Reliab. 86: 1-9 (2018)

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