"Effect of voids on thermo-mechanical reliability of chip resistor solder ..."

Paul Wild et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.04.014

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type: Journal Article

metadata version: 2025-01-19

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Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann:
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectron. Reliab. 85: 163-175 (2018)

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