"Creep of thermally aged SnAgCu-solder joints."

Steffen Wiese, Klaus-Jürgen Wolter (2007)

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DOI: 10.1016/J.MICROREL.2006.09.006

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type: Journal Article

metadata version: 2022-10-02

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Steffen Wiese, Klaus-Jürgen Wolter:
Creep of thermally aged SnAgCu-solder joints. Microelectron. Reliab. 47(2-3): 223-232 (2007)

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