"Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders."

Steffen Wiese, Klaus-Jürgen Wolter (2004)

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DOI: 10.1016/J.MICROREL.2004.04.016

access: closed

type: Journal Article

metadata version: 2022-10-02

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Steffen Wiese, Klaus-Jürgen Wolter:
Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectron. Reliab. 44(12): 1923-1931 (2004)

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