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"Nanomechanical properties of Ag solder bumps doped with Pd and Au."
Hua-Chiang Wen et al. (2017)
- Hua-Chiang Wen, Wu-Ching Chou, Shiuan Huei Lin, Don Son Jiang:
Nanomechanical properties of Ag solder bumps doped with Pd and Au. Microelectron. Reliab. 79: 270-275 (2017)
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