"AVD^® technology for deposition of next generation devices."

U. Weber et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.11.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee:
AVD^® technology for deposition of next generation devices. Microelectron. Reliab. 45(5-6): 945-948 (2005)

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