"Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb ..."

Fengjiang Wang et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.04.031

access: closed

type: Journal Article

metadata version: 2020-02-22

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Fengjiang Wang, Dongyang Li, Shuang Tian, Zhijie Zhang, Jiheng Wang, Chao Yan:
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration. Microelectron. Reliab. 73: 106-115 (2017)

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