"SEM in situ study on high cyclic fatigue of SnPb-solder joint in the ..."

Xi-Shu Wang et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.02.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Xi-Shu Wang, Xu-Dong Li, Huai-Hui Ren, Hai-Yan Zhao, Ryosuke Murai:
SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging. Microelectron. Reliab. 51(8): 1377-1384 (2011)

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