"Effects of solder balls and arrays on the failure behavior in ..."

Xi-Shu Wang et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.11.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Xi-Shu Wang, Su Jia, Huai-Hui Ren, Pan Pan:
Effects of solder balls and arrays on the failure behavior in Package-on-Package structure. Microelectron. Reliab. 54(3): 633-640 (2014)

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