"Chip-packaging interaction: a critical concern for Cu/low k packaging."

Guotao Wang, Paul S. Ho, Steven Groothuis (2005)

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DOI: 10.1016/J.MICROREL.2004.12.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Guotao Wang, Paul S. Ho, Steven Groothuis:
Chip-packaging interaction: a critical concern for Cu/low k packaging. Microelectron. Reliab. 45(7-8): 1079-1093 (2005)

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