"Thermo-mechanical characterization of passive stress sensors in Si interposer."

Benjamin Vianne et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.02.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas:
Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectron. Reliab. 55(5): 738-746 (2015)

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