"Transition from flip chip solder joint to 3D IC microbump: Its effect on ..."

King-Ning Tu, Hsiang-Yao Hsiao, Chih Chen (2013)

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DOI: 10.1016/J.MICROREL.2012.07.029

access: closed

type: Journal Article

metadata version: 2020-02-22

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King-Ning Tu, Hsiang-Yao Hsiao, Chih Chen:
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy. Microelectron. Reliab. 53(1): 2-6 (2013)

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