"Effect of annealing on the microstructure and bonding interface properties ..."

Yi-Wei Tseng et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.05.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui, Mei-Yu Chen, Hao-Wen Hsueh:
Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire. Microelectron. Reliab. 55(8): 1256-1261 (2015)

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