"Determination of residual strains of the EMC in PBGA during manufacturing ..."

Ming-Yi Tsai et al. (2011)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2010.10.009

access: closed

type: Journal Article

metadata version: 2024-05-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/TsaiTHL11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/TsaiTHL11
Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai:
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectron. Reliab. 51(3): 642-648 (2011)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.