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"Thermal deformation measurements and predictions of MAP-BGA electronic ..."
Ming-Yi Tsai et al. (2006)
- Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu:
Thermal deformation measurements and predictions of MAP-BGA electronic packages. Microelectron. Reliab. 46(2-4): 476-486 (2006)
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