"Board level solder joint reliability analysis and optimization of ..."

Tong Yan Tee, Zhaowei Zhong (2004)

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DOI: 10.1016/J.MICROREL.2004.04.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Yan Tee, Zhaowei Zhong:
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. Microelectron. Reliab. 44(12): 1957-1965 (2004)

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