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"Wafer-level Cu-Cu bonding technology."

Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen (2012)

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DOI: 10.1016/J.MICROREL.2011.04.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen:
Wafer-level Cu-Cu bonding technology. Microelectron. Reliab. 52(2): 312-320 (2012)

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