"Early experience with in situ chip-to-chip alignment characterization of ..."

Theresa Sze et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.02.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere:
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectron. Reliab. 50(4): 498-506 (2010)

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