"Measurement of underfill interfacial and bulk fracture toughness in ..."

Shrikant Swaminathan et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.09.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Shrikant Swaminathan, Kamal K. Sikka, Richard F. Indyk, Tuhin Sinha:
Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages. Microelectron. Reliab. 66: 161-172 (2016)

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