"Mechanical and thermal characterization of a novel nanocomposite thermal ..."

Shuangxi Sun et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.10.028

access: closed

type: Journal Article

metadata version: 2020-10-26

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Shuangxi Sun, Si Chen, Xin Luo, Yifeng Fu, Lilei Ye, Johan Liu:
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging. Microelectron. Reliab. 56: 129-135 (2016)

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