"Low-temperature low-pressure die attach with hybrid silver particle paste."

K. Suganuma et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.07.088

access: closed

type: Journal Article

metadata version: 2020-02-22

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K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K. S. Kim, M. Nogi:
Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectron. Reliab. 52(2): 375-380 (2012)

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