"An artificial neural network approach for wafer dicing saw quality prediction."

Te-Jen Su et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.10.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Te-Jen Su, Yi-Feng Chen, Jui-Chuan Cheng, Chien-Liang Chiu:
An artificial neural network approach for wafer dicing saw quality prediction. Microelectron. Reliab. 91: 257-261 (2018)

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