"Analytical and finite element models of the thermal behavior for lead-free ..."

Nele Van Steenberge et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.010

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type: Journal Article

metadata version: 2024-10-06

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Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans:
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. Microelectron. Reliab. 47(2-3): 215-222 (2007)

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