"A study of considering the reliability issues on ASIC/Memory integration ..."

Yong-Ha Song et al. (2003)

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DOI: 10.1016/S0026-2714(03)00251-8

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type: Journal Article

metadata version: 2020-02-22

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Yong-Ha Song, S. G. Kim, S. B. Lee, K. J. Rhee, T. S. Kim:
A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology. Microelectron. Reliab. 43(9-11): 1405-1410 (2003)

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