"Semiconductor package qualification based on the swelling temperature."

K. H. Song, J. S. Jang (2017)

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DOI: 10.1016/J.MICROREL.2016.12.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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K. H. Song, J. S. Jang:
Semiconductor package qualification based on the swelling temperature. Microelectron. Reliab. 69: 71-79 (2017)

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