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"Comparative studies on solder joint reliability of CTBGA assemblies with ..."

Hongbin Shi, Toshitsugu Ueda (2011)

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DOI: 10.1016/J.MICROREL.2011.07.034

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hongbin Shi, Toshitsugu Ueda:
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test. Microelectron. Reliab. 51(9-11): 1898-1902 (2011)

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