"Investigation of long-term reliability and failure mechanism of solder ..."

X. Q. Shi, John H. L. Pang, X. R. Zhang (2004)

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DOI: 10.1016/J.MICROREL.2003.12.001

access: closed

type: Journal Article

metadata version: 2023-09-30

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X. Q. Shi, John H. L. Pang, X. R. Zhang:
Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectron. Reliab. 44(5): 841-852 (2004)

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