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"Experiment and numerical analysis for edge and corner bonded PoP bottom ..."
Hongbin Shi, Fa Xing Che, Toshitsugu Ueda (2011)
- Hongbin Shi, Fa Xing Che
, Toshitsugu Ueda:
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending. Microelectron. Reliab. 51(9-11): 1850-1855 (2011)
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