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"Thermal resistance modelling and design optimization of PCB vias."

Yanfeng Shen, Huai Wang, Frede Blaabjerg (2018)

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DOI: 10.1016/J.MICROREL.2018.07.028

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yanfeng Shen, Huai Wang, Frede Blaabjerg:
Thermal resistance modelling and design optimization of PCB vias. Microelectron. Reliab. 88-90: 1118-1123 (2018)

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