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"An investigation of reliability of solder joints in microelectronic ..."
Haixia Shang et al. (2011)
- Haixia Shang, Jianxin Gao, Pascual Ian Nicholson, Steve Kenny:
An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method. Microelectron. Reliab. 51(5): 994-1002 (2011)
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