"Non destructive 3D chip inspection with nano scale potential by use of ..."

Rudolf Schlangen et al. (2007)

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DOI: 10.1016/J.MICROREL.2007.07.082

access: closed

type: Journal Article

metadata version: 2020-02-22

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Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist:
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectron. Reliab. 47(9-11): 1523-1528 (2007)

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