"Power cycling testing and FE modelling focussed on Al wire bond fatigue in ..."

Oliver Schilling et al. (2012)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2012.06.095

access: closed

type: Journal Article

metadata version: 2022-02-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/SchillingSMTS12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/SchillingSMTS12
Oliver Schilling, Marc Schäfer, Krzysztof Mainka, Markus Thoben, Frank Sauerland:
Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules. Microelectron. Reliab. 52(9-10): 2347-2352 (2012)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.