"Influence of sample preparation on intrinsic stresses inside a model Chip ..."

T. Schaffus et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.093

access: closed

type: Journal Article

metadata version: 2020-02-22

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T. Schaffus, P. Albert, W. Breuer, D. Debie, M. Graml, C. Hollerith, F. Kroninger, W. Mack, H. Pfaff, M. Schaffus, J. Walter:
Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation. Microelectron. Reliab. 88-90: 299-303 (2018)

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