"In-situ X-ray μLaue diffraction study of copper through-silicon vias."

Dario Ferreira Sanchez et al. (2016)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2015.10.008

access: closed

type: Journal Article

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/SanchezRWMRMGB16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/SanchezRWMRMGB16
Dario Ferreira Sanchez, Shay Reboh, Monica Larissa Djomeni Weleguela, Jean-Sébastien Micha, Odile Robach, Thierry Mourier, Patrice Gergaud, Pierre Bleuet:
In-situ X-ray μLaue diffraction study of copper through-silicon vias. Microelectron. Reliab. 56: 78-84 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.