"Study of die attach technologies for high temperature power electronics: ..."

Wissam Sabbah et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.101

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard:
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy. Microelectron. Reliab. 53(9-11): 1617-1621 (2013)

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