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"Effect of test condition and stress free temperature on the ..."
Arijit Roy et al. (2005)
- Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen:
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectron. Reliab. 45(9-11): 1443-1448 (2005)
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