"Evaluation of reliability and metallurgical integrity of wire bonds and ..."

Daniel T. Rooney et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.01.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Daniel T. Rooney, Louis Gullo, Dongji Xie, N. Todd Castello, Dongkai Shanguan:
Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules. Microelectron. Reliab. 47(12): 2152-2160 (2007)

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