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"Moisture absorption and desorption in wafer level chip scale packages."

Kirsten Rongen et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.129

access: closed

type: Journal Article

metadata version: 2022-05-18

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Kirsten Rongen, Amar Mavinkurve, M. Chen, P. J. van der Wel, F. Swartjes, Rene T. H. Rongen:
Moisture absorption and desorption in wafer level chip scale packages. Microelectron. Reliab. 55(9-10): 1872-1876 (2015)

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