"Reliability studies of two flip-chip BGA packages using power cycling test."

Quan Qi (2001)

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DOI: 10.1016/S0026-2714(00)00252-3

access: closed

type: Journal Article

metadata version: 2020-02-22

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Quan Qi:
Reliability studies of two flip-chip BGA packages using power cycling test. Microelectron. Reliab. 41(4): 553-562 (2001)

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