"Modern IC packaging trends and their reliability implications."

R. Plieninger, M. Dittes, Klaus Pressel (2006)

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DOI: 10.1016/J.MICROREL.2006.08.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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R. Plieninger, M. Dittes, Klaus Pressel:
Modern IC packaging trends and their reliability implications. Microelectron. Reliab. 46(9-11): 1868-1873 (2006)

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