"Comparison of thermo-mechanical behavior of lead-free copper and tin-lead ..."

S. B. Park, Rahul Joshi (2008)

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DOI: 10.1016/J.MICROREL.2007.12.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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S. B. Park, Rahul Joshi:
Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages. Microelectron. Reliab. 48(5): 763-772 (2008)

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