"Intermediate wafer level bonding and interface behavior."

C. T. Pan et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.10.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. T. Pan, P. J. Cheng, M. F. Chen, C. K. Yen:
Intermediate wafer level bonding and interface behavior. Microelectron. Reliab. 45(3-4): 657-663 (2005)

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