"Nanoporous gold bumps for low temperature bonding."

Hermann Oppermann, Lothar Dietrich (2012)

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DOI: 10.1016/J.MICROREL.2011.06.027

access: closed

type: Journal Article

metadata version: 2023-09-30

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Hermann Oppermann, Lothar Dietrich:
Nanoporous gold bumps for low temperature bonding. Microelectron. Reliab. 52(2): 356-360 (2012)

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