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"Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in ..."
Masaki Omiya et al. (2013)
- Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen
, Hisashi Sato, Masahiro Nishida
, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo:
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. Microelectron. Reliab. 53(4): 612-621 (2013)
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