"Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in ..."

Masaki Omiya et al. (2013)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2012.12.009

access: closed

type: Journal Article

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/OmiyaKSKCSNSNSN13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/OmiyaKSKCSNSNSN13
Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo:
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. Microelectron. Reliab. 53(4): 612-621 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.