"Wire-bond failure mechanisms in plastic encapsulated microcircuits and ..."

Frøydis Oldervoll, Frode Strisland (2004)

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DOI: 10.1016/J.MICROREL.2004.02.012

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type: Journal Article

metadata version: 2020-02-22

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Frøydis Oldervoll, Frode Strisland:
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures. Microelectron. Reliab. 44(6): 1009-1015 (2004)

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