"Evaluation of hybrid bonding technology of single-micron pitch with planar ..."

Masaki Ohyama et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.12.033

access: closed

type: Journal Article

metadata version: 2020-02-22

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Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou:
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectron. Reliab. 59: 134-139 (2016)

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