"Prediction of the epoxy moulding compound aging effect on package reliability."

Sander Noijen et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.02.025

access: closed

type: Journal Article

metadata version: 2023-09-30

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Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout:
Prediction of the epoxy moulding compound aging effect on package reliability. Microelectron. Reliab. 50(7): 917-922 (2010)

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