"A comprehensive solution for electronic packages' reliability assessment ..."

Yuling Niu et al. (2018)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2018.06.006

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/NiuWSWLP18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/NiuWSWLP18
Yuling Niu, Jing Wang, Shuai Shao, Huayan Wang, Hohyung Lee, Seungbae Park:
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method. Microelectron. Reliab. 87: 81-88 (2018)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.