"Reliability studies of barrier layers for Cu/PAE low-k interconnects."

Hung Son Nguyen et al. (2006)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2005.11.005

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/NguyenGCCPMJ06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/NguyenGCCPMJ06
Hung Son Nguyen, Z. H. Gan, Zhe Chen, V. Chandrasekar, K. Prasad, S. G. Mhaisalkar, Ning Jiang:
Reliability studies of barrier layers for Cu/PAE low-k interconnects. Microelectron. Reliab. 46(8): 1309-1314 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.